[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"aihot-art-95492":3},{"itemId":4,"vertical":5,"category":6,"source":7,"score":8,"title":9,"summary":10,"analysis":11,"url":12,"coverUrl":13,"direction":13,"marketSignal":13,"publishedAt":14},"95492","ai","行业动态","IT之家",53,"先封科技发布国内首款AI算力芯片玻璃基CoPoS样品，联合燧原开发","先封科技与燧原联合发布国内首款AI算力芯片玻璃基CoPoS先进封装样品。","先封科技与燧原科技联合发布国内首款 AI 算力芯片玻璃基 CoPoS 先进封装样品，突破国产封装技术。\n· 样品综合应用玻璃基板、PVD、面板级光刻、精密电镀增层等多种工艺。\n· 这是燧原高端 AI 芯片首次与国产 CoPoS 封装结合，提升芯片性能和散热能力。\n· 玻璃基板相比传统有机基板具有更低热膨胀系数和更高互连密度，适合大尺寸 AI 芯片。\n影响\u002F看点：该封装技术有望降低对海外先进封装的依赖，为国产 AI 芯片提供高性能、高可靠性的封装方案，助力自主算力生态建设。","https:\u002F\u002Fwww.ithome.com\u002F0\u002F979\u002F096.htm",null,"2026-07-20 16:34:36"]